The non-destructive X-ray CT can analyze the uniformity of the copper plating thickness of the PCB through-holes, the broken defects of the PCB trace, and the drilling depth.
X-ray CT scanning can be performed for pores, cracks, and cold soldering in various components such as SMT process, BGA, QFN, QFP/SOP, flip chip, THT, press-fit pins, TSV, bonding wire, power semiconductor IGBT and MEMS.
Sanying provides a variety of solutions for the electronics industry. High-resolution micro CT products are mainly used for research and analysis. Planner CT can be used for rapid tomography and can be imported into the production line as a full on-line testing system.